Rayne serves as the Head of Hardware Platform at HIA, leading the technical roadmap and architecture for our device ecosystems. He brings extensive expertise in embedded systems, IoT, and internet services, with a strong focus on driving engineering efficiency through agile practices and AI-assisted workflows.
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U.S. Office
8 The Green, Suite B, Dover, DE, 19901, USA
Hong Kong Office
Unit 2406, 24/F, Low Block, Grand Millennium Plaza, 181 Queen's Road Central, Sheung Wan, Hong Kong
Stockholm Office
Brännkyrkagatan 76, 118 23 Stockholm Sweden
Shenzhen Office
Unit 2305, Building T1, Fangdacheng, No. 2 Longzhu 4th Road, Nanshan District, Shenzhen, People’s Republic of China